ECI Scientists Receive IMAPS Award

Following a presentation on Monitoring of Wet Etch for Wafer Thinning and Via Reveal Process, Co-author and presenter Chuannan Bai of ECI's R&D department received the honor of "Best in Session". This was awarded as part of the Internation Microelectronics Assembly and Packaging Society's 46th International Symposium on Microelectronics. 

ECI is proud of our world-class scientists and congratulate Authors Chuannan Bai, Eugene Shalyt, Guang Liang, and Peter Bratin on their achievement and presentation.

imaps best in session award