ECI @ Semicon Taiwan 2014

Special Invitation from ECI Technology

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Visit Us at Semicon Taiwan 2014 in Taipei City, Sept 3-5
Booth #912

We will introduce the latest
E-Series Analyzers
Focused on Solutions for the Challenges of Sub-20nm
and Significant CoO Reduction

Comprehensive analysis of all Plating and Cleaning processes including analysis of major components and breakdown products for:

Plating Cleaning
  • Advanced Wafer Level Packaging
    • Electroplating or Electroless
    • SnAg, Cu, Ni, Au, Co, Pd, Sn
  • 3D-iC TSV
  • Cu Damascene
  • IC Substrates
  • Silicon Nitride Etch (Hot H3PO4)
  • Post Ash Polymer Removal
  • Sigma Formation Etch (TMAH)
  • TSV Via Reveal
  • PR Strip
  • Seed Layer Etch
  • ECI Technology is the global leader in Chemical Monitoring and Dosing Systems specializing in Cu Damascene, advanced WLP, and 3DiC TSV, and cleaning technologies. We look forward to seeing you and discussing how we can meet your sub-20nm needs at the show!
    +1 (973) 890-1114