ECI at Semicon West 2014!



Special Invitation from ECI Technology, Inc.

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Visit Us at Semicon West 2014 in San Francisco, July 8-11
Booth #828

We will introduce the latest
E-Series Analyzers
Focused on Solutions for the Challenges of Sub-20nm
and Significant CoO Reduction

Comprehensive analysis of all Plating and Cleaning processes including analysis of major components and breakdown products for:

Plating Cleaning
  • Advanced Wafer Level Packaging
    • Electroplating or Electroless
    • SnAg, Cu, Ni, Au, Co
  • 3D-iC TSV
  • Cu Damascene
  • Substrates
  • Si Nitride Etch
  • Polymer Removal
  • TMAH
  • ECI Technology is the global leader in Chemical Monitoring and Dosing Systems specializing in Cu Damascene, advanced WLP, and 3DiC TSV, and cleaning technologies. We look forward to seeing you and discussing how we can meet with your sub-20nm needs at the show!

    See you there,

    Woojin Lee
    Director,
    Product Marketing
    ECI Technology, Inc.

    info@ecitechnology.com
    +1 (973) 890-1114