News

Aug. 27
2016
ECI is presenting "Metrology for High Selective Si Nitride Etch" at the 13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces in Knokke-Heist, Belgium.  ECI's world-leading R&D continues to contribute to the progress of modern semiconductor fabricati...
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Aug. 22
2016
ECI Technology’s Quali-Fill® E-系列是​​一款全新設計的即時化學分析系統。在ECI領先業界的化學監測技術上,Quali-Fill E-系列系統提供一個全自動化的化學品量測和智能型化學成分計量添加的功能。   Quali-Fill E-系列系統分析功能包括Copper Pillar, RDL, Micro-Bump和 UBM 製程溶液。Quali-Fill E-系列系統採用了最新的模組化設計,不但能夠同時支援多個化學槽,如Cu(銅)、SnAg(錫銀)、Sn(錫)、Ni(鎳)和 Au(金),還能夠任意擴充或新...
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May. 04
2016
ECI scientists Chuannan Bai, Eugene Shalyt, Guang Liang, Jingjing Wang, Michael McEwan, and Helen Liu co-authored a presentation entitled "Metrology for Post Etch Residue Removal", which was given at the 2016 Surface Preparation and Cleaning Conference, held on April 19-20 in Santa Clara,...
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Apr. 29
2016
ECI's world-leading R&D scientists publish their latest findings in a short infographic entitled "Non Reagent Metrology for Modern TSV Copper Plating Baths." This information was presented on April 15th at the 2016 IEEE Workshop on Microelectronics and Electron Devices at Boise Sta...
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Oct. 24
2014
ECI Technology scientists presented a technical paper on TMAH monitoring at the 12 International Symposiom on Ultra Clean Processing of Semiconductor Surfaces in Brussels, Belgium earlier this month. The presentation is available as an article here.
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Oct. 21
2014
ECI Scientists presented new metrology developments for Ni electrodeposition at the ElectroChemical Society's biannual meeting in Cancun, Mexico. This major international conference offers a unique blend of electrochemical and solid-state science and technology; and serves as a major forum for t...
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Aug. 21
2014
Special Invitation from ECI Technology Please click here to display in html format. Visit Us at Semicon Taiwan 2014 in Taipei City, Sept 3-5 Booth #912 We will introduce the latest E-Series A...
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Jul. 03
2014
Special Invitation from ECI Technology, Inc. Please click here to display in html format. Visit Us at Semicon West 2014 in San Francisco, July 8-11 Booth #828 We will introduce the latest E-S...
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Oct. 02
2013
Following a presentation on Monitoring of Wet Etch for Wafer Thinning and Via Reveal Process, Co-author and presenter Chuannan Bai of ECI's R&D department received the honor of "Best in Session". This was awarded as part of the Internation Microelectronics Assembly and Packaging So...
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Jun. 12
2013
ECI will be exhibiting at Semicon West 2013, booth 731 in South Hall. Come by and be introduced to our new generation of Quali-Line Chemical Monitoring Systems, along with many other advancements in chemical metrology for Wafer Level Packaging, TSV, Clean and Etch processes, and more.
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