Surface Preparation

Etch control

We offer the most efficient, cost effective, and advanced equipment for monitoring and controlling critical and challenging Clean and Etch processes.

Today’s process demands for sub 20nm lines, FinFET transistors, and 3D stacking – all require wet process control beyond yesterday’s equipment capabilities. Scaling down to MOL and the multilayers of BEQL expand the number of required selective deposition chemical deposition steps. Rapid roll-out from R&D to HVM means wet chemical deposition equipment must be accurate, scalable, yet affordable.